Double Sided Adhesive Copper Tape
 | Double Sided Adhesive Copper Tape
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Insulative Tape Company is a manufacturer of double sided adhesive copper tape for electronic assemblies that need bonding and electrical connection on both sides of the same material. Built with a copper foil carrier and conductive adhesive on both sides, the tape helps join metal parts, conductive gaskets, shield cans, and EMI seams with a cleaner assembly process. It is suited for flat lamination, die-cut parts, liner-supported placement, and grounding areas where contact stability matters.
Product Photos
Benefits
- Bonds two conductive surfaces while helping maintain an electrical grounding path through the tape stack.
- Conductive adhesive on both sides reduces gaps between shielded parts, gaskets, and metal contact areas.
- Copper foil carrier gives the tape better handling than unsupported conductive adhesive transfer film.
- Double release liners keep both adhesive faces protected until each lamination step is ready.
- Kiss-cut parts can include liner tabs, waste borders, positioning holes, and small-part pickup support.
- Works for flat lamination on metal housings, shield cans, brackets, conductive gaskets, and electronic modules.
- Same-tack or differential-tack sides can be planned when one side needs to be bonded before the other.
- Typical 180 degree peel adhesion can be adjusted around 3.0-6.5 N/10 mm, depending on surface condition and adhesive coat weight.
- Roller pressure of 0.2 MPa-0.4 MPa, clean metal contact, and a flat edge profile help reduce resistance variation after assembly.
Applications
- EMI seam connection between metal covers, shield cans, and conductive housings
- Conductive gasket attachment for foam, fabric, copper, or metal mesh gasket parts
- Metal part lamination where both faces need adhesive contact and electrical continuity
- Electronic module assembly for grounding pads, sensors, brackets, and shielding pieces
- Die-cut conductive pads used in compact electronic devices
- Frame-shaped copper foil parts for enclosure seams and contact zones
- Fixture-positioned bonding where liner support helps keep small parts aligned
- Assembly designs where first-side and second-side adhesion need different handling behavior
- Contact zones that require flat lamination, controlled pressure, and low resistance variation
Where Does Double Sided Adhesive Copper Tape Work Best in Electronic Assembly?
This double sided conductive copper tape works best when two conductive parts must be fixed and connected in one assembly step. It is commonly used to hold conductive gaskets, ground shield cans, bond metal housing seams, and support compact electronic module assembly. One side may first bond to a gasket, copper part, metal bracket, or shielding piece. The second side can then bond to a housing, PCB grounding area, or another conductive surface. For small die-cut parts, leaving one liner in place during positioning helps reduce adhesive contamination, stretching, and misalignment before final bonding. With clean, flat contact and proper pressure, typical Z-axis contact resistance can be controlled at <=0.05 ohm.
Product Overview
Double sided adhesive copper tape is used when two surfaces need to be bonded together and still keep a conductive path through the material. In this construction, a 35 um-70 um rolled copper foil carrier sits in the center, with conductive acrylic adhesive coated on both faces. Each adhesive face is protected by a liner, so one side can be placed onto a gasket, metal bracket, copper part, or shielding component first, while the second side remains clean until the final bonding step.
This is different from common single-sided adhesive copper tape. It is not mainly intended for cable wrapping, surface patching, or decorative copper work. Its better fit is sandwich-style assembly, such as metal-to-metal bonding, conductive foam or fabric gasket attachment, shield can grounding, and EMI seam bonding where two mating surfaces need both holding force and electrical continuity. For die cut copper foil parts, the liner supports small pads, rings, frames, and tabs through kiss cutting, waste stripping, pickup, and fixture positioning.
Practical inspection should cover both adhesive faces, not only the copper layer. Typical checks include total thickness control at 80 um-160 um, first-side and second-side peel adhesion around 3.0-6.5 N/10 mm, liner release balance, die-cut edge flatness, and contact resistance after roller pressure. Before assembly, surfaces should be checked for oil, oxide, burrs, dust, and trapped air, as these can reduce adhesive wet-out and affect grounding stability. The values below are typical reference data and should be confirmed by sample testing on the final metal, gasket, or module surface.
Technical Data Sheet
Item | Typical Value |
Product Type | Double sided conductive copper tape |
Copper Foil Carrier | 35 um-70 um rolled copper foil |
Adhesive Type | Electrically conductive acrylic adhesive |
Adhesive Coating | Conductive adhesive on both sides |
Total Thickness | 80 um-160 um, depending on copper and adhesive build |
Release Liner | Paper or PET liner on both adhesive faces |
Color | Natural copper with white, yellow, or clear liner option |
Width Range | 3 mm-500 mm slit roll, wider log roll available before converting |
Roll Length | 10 m-50 m standard, longer roll by production plan |
Die-Cut Form | Pads, strips, rings, frames, tabs, and gasket shapes |
180 Degree Peel Adhesion | 3.0-6.5 N/10 mm on stainless steel after 20 min dwell |
First Side / Second Side Tack | Same tack or differential tack available by construction |
Z-Axis Contact Resistance | Typical <=0.05 ohm under controlled pressure and clean metal contact |
Holding Power | >=24 h at 23 C with 1 kg load on tested metal panel |
Tensile Strength | 35-60 N/10 mm depending on copper foil thickness |
Elongation | 3%-8% typical copper foil range |
Recommended Lamination Pressure | 0.2 MPa-0.4 MPa roller pressure for flat bonding |
Working Temperature | -20 C to 120 C typical application range |
Die-Cut Tolerance | +/-0.2 mm to +/-0.5 mm depending on part size and tool design |
Surface Check Before Bonding | Remove oil, oxide, dust, burrs, and loose particles before lamination |
Storage Condition | 20 C-30 C, 50%-70% RH, away from oxidation and dust |
How Should the Two Release Liners Be Peeled During Lamination?
The liner sequence matters because both adhesive faces are active bonding surfaces. A practical method is to peel the first liner, place the exposed side onto the metal part, gasket, or shield component, and apply roller pressure at about 0.2 MPa-0.4 MPa to improve wet-out and flatness. After the first side is stable, the second liner can be removed for final bonding. For die-cut parts, pull tabs or extended liner edges help reduce finger contact with the adhesive. When the two sides have different tack levels, the stronger side is usually laminated first, while the second side stays protected until final assembly. This helps reduce wrinkles, trapped air, edge lift, and contact resistance variation.
FAQ
Is this tape the same as ordinary adhesive copper tape?
No. This is a double sided structure with conductive adhesive on both sides for two-surface bonding and electrical connection.
Can it be supplied as die-cut parts?
Yes. It can be converted into pads, rings, strips, frame shapes, tabs, and liner-supported parts for assembly.
Does surface preparation affect conductivity?
Yes. Oil, oxide, dust, burrs, and uneven pressure can increase contact resistance or reduce adhesive wet-out.
Can both sides have different adhesion levels?
Yes. Same-tack and differential-tack constructions can be planned according to the bonding sequence.