Double Sided Adhesive Thermal Conductive Tape

Double Sided Adhesive Thermal Conductive Tape Structure: no-substrate layer or PET/PEN carrier type Thickness: 0.10 mm, 0.15 mm, 0.20 mm, 0.25 mm, 0.30 mm, 0.50 mm Adhesive: ceramic-filled acrylic pressure sensitive adhesive Color: white, gray, or black by grade Format: slit rolls, sheets, or die-cut parts Reference tolerance: die-cut parts typically +/-0.2 mm after drawing confirmation Contact Us

Double sided adhesive thermal conductive tape is made for assemblies where a heat sink must stay bonded to a power dissipation semiconductor while heat is transferred through the same adhesive layer. Insulative Tape Company manufactures no-substrate and with-substrate grades for thin bond lines, low thermal resistance, peel adhesion, and dielectric insulation. It is used in engineered heat sink bonding designs, not as an electrically conductive copper or aluminum foil tape.

Product Photos

Benefits

• Bonds heat sinks to power semiconductors while helping transfer heat through the adhesive layer.
• Reduces the need for thermal grease, screws, clips, or brackets in suitable structures.
• Provides electrically insulating thermal tape options with controlled breakdown voltage.
• Offers typical 180 degree peel adhesion of 8-18 N/25 mm after standard dwell time.
• Supports thin electronic designs where added fasteners increase height or assembly steps.
• Allows thickness selection to balance thermal resistance, handling, and bonding strength.
• Can be supplied as slit rolls, sheets, or die-cut parts for repeatable placement.
• Typical sample assembly observation includes 24-72 hour bonding hold after heat exposure.

Applications

• Aluminum heat sink bonding for MOSFETs, IGBT modules, and other power semiconductor packages.
• LED module and LED base board attachment where heat must move into a metal housing.
• Heat spreader, heat pipe, and cooling plate bonding in compact electronic assemblies.
• PCB, FPC, and power board applications that require dielectric insulation.
• Thin designs that need a low thermal resistance adhesive tape instead of added screws or clips.
• Die-cut thermal adhesive parts for automated placement, repeatable positioning, and small component bonding.
• Assemblies where a thin adhesive layer is preferred over liquid thermal materials.

What Should Be Checked Before Bonding Heat Sinks to Power Semiconductors?

Before applying the tape, the bonding area should be checked as carefully as the tape specification. Oil, dust, oxide film, machining residue, loose coating, or uneven pressure can create small air gaps that increase thermal resistance. The heat sink and semiconductor surface should be clean, dry, and stable before lamination. For a shorter heat path, a thin no-substrate grade is often preferred. If the part is difficult to place, has a narrow shape, or needs better die-cut stability, a carrier-based grade may be the safer choice.

Technical Data Sheet

Product Overview

This tape is used when a heat sink needs to be fixed to a heat-generating component without adding a separate layer of thermal grease and extra mechanical hardware. In many power electronics assemblies, the adhesive must do two jobs at the same time: create a useful heat transfer path and keep the cooling part in position during handling, testing, and service.

The tape can be supplied as a no-substrate thermally conductive transfer tape or as a carrier-based construction. A no-substrate grade is normally chosen when the design needs a thinner bond line and a shorter heat path. A with-substrate grade is easier to handle during converting and placement, especially for small die-cut parts, narrow strips, or shapes that need better dimensional stability.

Thermal conductivity is only one part of the selection. In real heat sink bonding, the final temperature rise is also affected by tape thickness, pressure during lamination, surface flatness, contact area, and how well the adhesive wets the metal and device surface. For power semiconductor cooling tape applications, sample testing should be done on the actual semiconductor package, heat sink material, bonding pressure, and working temperature before volume use.

How Can Thermal Conductive Tape Replace Grease and Mechanical Fixation?

Thermal grease can help fill surface texture, but it does not hold a heat sink in place by itself. Screws, clips, or brackets are usually needed to maintain pressure. Double sided adhesive thermal conductive tape combines bonding and heat transfer in one layer, so it can simplify selected assemblies where the heat sink surface, component surface, and contact area are suitable. When applied with proper pressure, the adhesive helps wet both surfaces and keeps the cooling part attached during use. Selection should still consider thermal resistance, 8-18 N/25 mm typical peel adhesion, 1.5-5.0 kV typical breakdown voltage, and long-term temperature exposure, not conductivity alone.

FAQ

Is this tape electrically conductive?

No. This material is an electrically insulating thermal adhesive tape. It is different from copper foil tape, aluminum foil tape, or electrically conductive shielding tape.

Can it replace thermal grease completely?

It can replace thermal grease plus mechanical fixation in suitable designs, but sample assembly testing is recommended. Surface condition, contact area, bonding pressure, and heat load should be checked first.

Which thickness should be selected?

Thin grades such as 0.10 mm or 0.15 mm support shorter thermal paths. Thicker grades such as 0.30 mm or 0.50 mm can improve handling, gap tolerance, and die-cut stability. Final selection should be confirmed by temperature rise testing.

What surface preparation is needed before bonding?

The heat sink and semiconductor surface should be clean, dry, and free from oil, dust, oxide film, and loose coating. Uniform pressure should be applied after lamination to improve surface wet-out and bonding reliability.